YFZVFH24B
Product Detail
規格:
Grade
Automotive
Common Standard
AEC-Q101 (Automotive Grade)
Configuration
Single
Package Code
SOD-323HE
Package Size [mm]
1.4x2.5 (t=0.8)
Package(JEITA)
SC-108B
Mounting Style
Surface mount
Number of terminal
2
Power Dissipation (PD)[mW]
500
Zener Voltage VZ (Min.)[V]
22.61
Zener Voltage VZ (Max.)[V]
23.77
IZ @ VZ [mA]
5
Storage Temperature (Min.)[°C]
-55
Storage Temperature (Max.)[°C]
150
功能:
- Small power mold type (TUMD2M)
- High reliability
- Automatic mounting is possible by chip-mounter
Design Resources
Technical Articles
Schematic Design & Verification
Thermal Design
- What Is Thermal Design
- Basics of Thermal Resistance and Heat Dissipation
- Method for Calculating Junction Temperature from Transient Thermal Resistance Data
- Notes for Temperature Measurement Using Thermocouples
- Two-Resistor Model for Thermal Simulation
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- What is a Thermal Model? (Diode)
- Measurement Method and Usage of Thermal Resistance RthJC
- Precautions When Measuring the Rear of the Package with a Thermocouple