Models
- RB531XN SPICE Model
- RB531XN Thermal Model (lib)
2D/3D/CAD
- UMD6 STEP Data
Characteristics Data
- ESD Data
RB531XN
RB531XN
Schottky Barrier Diodes
ROHM的蕭特基二極體是低VF、低IR、高ESD耐壓的產品。適合用於電腦、手幾、或其他各種攜帶型電子產品等。
雖然可以用於新設計，但可能會另行提供新的替代產品。
Product Detail
規格:
Grade
Standard
Configuration
Triple Line
Package Code
SOT-363
Package(JEITA)
SC-88
Package Size[mm]
2.0x2.1 (t=0.9)
Mounting Style
Surface mount
Number of terminal
6
Reverse Voltage VR[V]
30
Average Rectified Forward Current IO[A]
0.1
IFSM[A]
1.0
Forward Voltage VF(Max.)[V]
0.43
IF @ Forward Voltage [A]
0.1
Reverse Current IR(Max.)[mA]
0.03
VR @ Reverse Current[V]
10
Storage Temperature (Min.)[°C]
-40
Storage Temperature (Max.)[°C]
125
功能:
・小型化Mold Type。・低VF、高可靠性。
Design Resources
Technical Articles
Schematic Design & Verification
- Method for Monitoring Switching Waveform
- Importance of Probe Calibration When Measuring Power: Deskew
- Impedance Characteristics of Bypass Capacitor
Thermal Design
- Notes for Temperature Measurement Using Thermocouples
- Two-Resistor Model for Thermal Simulation
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- What is a Thermal Model? (Diode)
- Measurement Method and Usage of Thermal Resistance RthJC
- Precautions When Measuring the Rear of the Package with a Thermocouple
Tools
Models
- RB531XN SPICE Model
- RB531XN Thermal Model (lib)
2D/3D/CAD
- UMD6 STEP Data
Characteristics Data
- ESD Data
Packaging & Quality
Package Information
- Package Dimensions
- Inner Structure
- Taping Information
- Explanation for Marking
- Moisture Sensitivity Level
- Anti-Whisker formation
- Condition of Soldering
Manufacturing Data
- Reliability Test Result
Environmental Data
- Constitution Materials List
- About Flammability of Materials
- About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
- Compliance of the RoHS / ELV directive
Export Information
- About Export Regulations