Characteristics Data
- RB088BM200 ESD Data
RB088BM200
RB088BM200
200V, 10A, 超低IR 蕭特基二極體
RB088BM200是利用其超低IR特性，實現了高達200V的耐壓、用於開關電源的蕭特基二極體。與一般FRD產品相比，VF特性可降低約11％，有助於應用的低功耗化。
關於RBxx8系列
在高溫環境下使用的車電和電源設備的電路，希望將以往的整流二極體和FRD替換為效率性能更優異的SBD。然而另一方面，SBD存在的問題是隨著工作環境溫度上升，IR特性會惡化，容易引發熱失控。RBxx8系列採用非常適用於高溫環境的阻擋金屬，大大改善了IR特性，成功打造了在車電和工業設備等高溫環境下也可安全使用、無需擔心熱失控的SBD系列產品。
Product Detail
規格:
Grade
Standard
Configuration
C-Common
Package Code
TO-252 (DPAK)
Package(JEITA)
SC-63
Package Size[mm]
6.6x10.0 (t=2.2)
Mounting Style
Surface mount
Number of terminal
3
VRM[V]
200
Reverse Voltage VR[V]
200
Average Rectified Forward Current IO[A]
10.0
IFSM[A]
100.0
Forward Voltage VF(Max.)[V]
0.88
IF @ Forward Voltage [A]
5.0
Reverse Current IR(Max.)[mA]
0.007
VR @ Reverse Current[V]
200
Storage Temperature (Min.)[°C]
-55
Storage Temperature (Max.)[°C]
150
功能:
- High reliability
- Power mold type
- Cathode common dual type
- Super Low IR
Design Resources
Technical Articles
Schematic Design & Verification
- Method for Monitoring Switching Waveform
- Importance of Probe Calibration When Measuring Power: Deskew
- Impedance Characteristics of Bypass Capacitor
Thermal Design
- Notes for Temperature Measurement Using Thermocouples
- Two-Resistor Model for Thermal Simulation
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- What is a Thermal Model? (Diode)
- Measurement Method and Usage of Thermal Resistance RthJC
- Precautions When Measuring the Rear of the Package with a Thermocouple
Tools
Characteristics Data
- RB088BM200 ESD Data
Packaging & Quality
Package Information
- Package Dimensions
- Taping Information
- Explanation for Marking
- Moisture Sensitivity Level
- Anti-Whisker formation
- Condition of Soldering
Environmental Data
- About Flammability of Materials
- About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
- Compliance of the RoHS / ELV directive
Export Information
- About Export Regulations