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RBR3LAM60B
RBR3LAM60B
60V, 3A, 蕭特基二極體
RBR3LAM60B是低VF的一般整流用蕭特基二極體。
Product Detail
規格:
Grade
Standard
Configuration
Single
Package Code
SOD-128
Package Size[mm]
4.7x2.5 (t=0.95)
Mounting Style
Surface mount
Number of terminal
2
VRM[V]
60
Reverse Voltage VR[V]
60
Average Rectified Forward Current IO[A]
3.0
IFSM[A]
75.0
Forward Voltage VF(Max.)[V]
0.56
IF @ Forward Voltage [A]
3.0
Reverse Current IR(Max.)[mA]
0.15
VR @ Reverse Current[V]
60
Storage Temperature (Min.)[°C]
-55
Storage Temperature (Max.)[°C]
150
功能:
- Small power mold type (PMDTM)
- High reliability
- Low VF
Design Resources
Technical Articles
Schematic Design & Verification
- Method for Monitoring Switching Waveform
- Importance of Probe Calibration When Measuring Power: Deskew
- Impedance Characteristics of Bypass Capacitor
Thermal Design
- Notes for Temperature Measurement Using Thermocouples
- Two-Resistor Model for Thermal Simulation
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- What is a Thermal Model? (Diode)
- Measurement Method and Usage of Thermal Resistance RthJC
- Precautions When Measuring the Rear of the Package with a Thermocouple
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Simulations (Login Required)
- Method for Exporting Circuit Data (ROHM Solution Simulator)
Models
- RBR3LAM60B SPICE Model
Characteristics Data
- ESD Data
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