Simulations (Login Required)
- Method for Exporting Circuit Data (ROHM Solution Simulator)
Models
- RBQ15BM65A SPICE Model
- RBQ15BM65A Thermal Model (lib)
Characteristics Data
- ESD Data
RBQ15BM65A
RBQ15BM65A
65V, 15A, 蕭特基二極體
RBQ15BM65A是最適合一般整流用途的蕭特基二極體。
Product Detail
規格:
Grade
Standard
Configuration
C-Common
Package Code
TO-252 (DPAK)
Package(JEITA)
SC-63
Package Size[mm]
6.6x10.0 (t=2.2)
Mounting Style
Surface mount
Number of terminal
3
VRM[V]
65
Reverse Voltage VR[V]
65
Average Rectified Forward Current IO[A]
15.0
IFSM[A]
100.0
Forward Voltage VF(Max.)[V]
0.63
IF @ Forward Voltage [A]
7.5
Reverse Current IR(Max.)[mA]
0.14
VR @ Reverse Current[V]
65
Storage Temperature (Min.)[°C]
-55
Storage Temperature (Max.)[°C]
150
功能:
N/A
Design Resources
Technical Articles
Schematic Design & Verification
- Method for Monitoring Switching Waveform
- Importance of Probe Calibration When Measuring Power: Deskew
- Impedance Characteristics of Bypass Capacitor
Thermal Design
- Notes for Temperature Measurement Using Thermocouples
- Two-Resistor Model for Thermal Simulation
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- What is a Thermal Model? (Diode)
- Measurement Method and Usage of Thermal Resistance RthJC
- Precautions When Measuring the Rear of the Package with a Thermocouple
Tools
Simulations (Login Required)
- Method for Exporting Circuit Data (ROHM Solution Simulator)
Models
- RBQ15BM65A SPICE Model
- RBQ15BM65A Thermal Model (lib)
Characteristics Data
- ESD Data
Packaging & Quality
Package Information
- Package Dimensions
- Inner Structure
- Taping Information
- Explanation for Marking
- Moisture Sensitivity Level
- Anti-Whisker formation
- Condition of Soldering
Manufacturing Data
- Reliability Test Result
Environmental Data
- Constitution Materials List
- About Flammability of Materials
- About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
- Compliance of the RoHS / ELV directive
Export Information
- About Export Regulations