Models
- RSX501LAM20 SPICE Model
Characteristics Data
- RSX501LAM20 ESD Data
RSX501LAM20
RSX501LAM20
蕭特基二極體
RSX501LAM20是低VF、低 IR的蕭特基二極體。最適合一般整流用途。
Product Detail
規格:
Grade
Standard
Configuration
Single
Package Code
SOD-128
Package Size[mm]
4.7x2.5 (t=0.95)
Mounting Style
Surface mount
Number of terminal
2
VRM[V]
25
Reverse Voltage VR[V]
20
Average Rectified Forward Current IO[A]
5.0
IFSM[A]
100.0
Forward Voltage VF(Max.)[V]
0.39
IF @ Forward Voltage [A]
3.0
Reverse Current IR(Max.)[mA]
0.5
VR @ Reverse Current[V]
20
Storage Temperature (Min.)[°C]
-55
Storage Temperature (Max.)[°C]
125
功能:
- Small power mold type（PMDTM）
- High reliability
- Low VF and Low IR
Design Resources
Technical Articles
Schematic Design & Verification
- Method for Monitoring Switching Waveform
- Importance of Probe Calibration When Measuring Power: Deskew
- Impedance Characteristics of Bypass Capacitor
Thermal Design
- Notes for Temperature Measurement Using Thermocouples
- Two-Resistor Model for Thermal Simulation
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- What is a Thermal Model? (Diode)
- Measurement Method and Usage of Thermal Resistance RthJC
- Precautions When Measuring the Rear of the Package with a Thermocouple
Tools
Models
- RSX501LAM20 SPICE Model
Characteristics Data
- RSX501LAM20 ESD Data
Packaging & Quality
Package Information
- Package Dimensions
- Taping Information
- Explanation for Marking
- Moisture Sensitivity Level
- Anti-Whisker formation
- Condition of Soldering
Environmental Data
- About Flammability of Materials
- About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
- Compliance of the RoHS / ELV directive
Export Information
- About Export Regulations