Application Note
- How to Create Symbols for PSpice Models
RFUH10NS4S
RFUH10NS4S
Fast Recovery Diodes
ROHM的快速回復二極體為超快速且低VF的二極體，可大幅提升交換電源的效率與降低功率損失。
Product Detail
規格:
Grade
Standard
Configuration
Single
Package Code
TO-263S (D2PAK)
Package(JEITA)
SC-83
Package Size[mm]
13.3x10.1 (t=4.5)
Mounting Style
Surface mount
Number of terminal
3
VRM[V]
430
Reverse Voltage VR[V]
430
Average Rectified Forward Current IO[A]
10.0
IFSM[A]
80.0
Forward Voltage VF(Max.)[V]
1.7
IF @ Forward Voltage [A]
10.0
Reverse Current IR(Max.)[mA]
0.01
VR @ Reverse Current [V]
430
trr(Max.)[ns]
25
IF @ trr [mA]
500
IR @ trr [A]
1.0
Storage Temperature (Min.)[°C]
-55
Storage Temperature (Max.)[°C]
150
功能:
・Power Mold Type。・低VF、高可靠性。
Design Resources
Documents
Application Note
- How to Create Symbols for PSpice Models
Technical Articles
Schematic Design & Verification
- Method for Monitoring Switching Waveform
- Importance of Probe Calibration When Measuring Power: Deskew
- Impedance Characteristics of Bypass Capacitor
Thermal Design
- Notes for Temperature Measurement Using Thermocouples
- Two-Resistor Model for Thermal Simulation
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- What is a Thermal Model? (Diode)
- Measurement Method and Usage of Thermal Resistance RthJC
- Precautions When Measuring the Rear of the Package with a Thermocouple
Tools
Models
- RFUH10NS4S SPICE Model
- RFUH10NS4S Thermal Model (lib)
Characteristics Data
- ESD Data
Packaging & Quality
Package Information
- Package Dimensions
- Inner Structure
- Taping Information
- Explanation for Marking
- Moisture Sensitivity Level
- Anti-Whisker formation
- Condition of Soldering
Manufacturing Data
- Reliability Test Result
Environmental Data
- Constitution Materials List
- About Flammability of Materials
- About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
- Compliance of the RoHS / ELV directive
Export Information
- About Export Regulations