BU7461G
High Speed Ground Sense Operational Amplifier

接地感測低電壓工作CMOS運算放大器為將相位補償電容內建型輸出全振幅(Full Swing)的運算放大器1組電路/2組電路/4組電路集於單一晶片中的單晶體(Monolithic)IC。可低電壓工作,低耗電,輸入偏壓電流非常小為其特點。輸入為接地感測,輸出為全振幅。

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* 本產品是標準級的產品。
本產品不建議使用的車載設備。

Product Detail

 
料號 | BU7461G-TR
狀態 | 推薦品
封裝 | SSOP5
單位數量 | 3000
最小包裝數量 | 3000
包裝形式 | Taping
RoHS | Yes

規格:

Grade

Standard

Power supply(Min.)[V](+5V=5, +/-5V=10)

1.7

Power supply(Max.)[V](+5V=5, +/-5V=10)

5.5

Channel

1

Circuit Current(Typ.)[mA]

0.15

Input Offset Voltage(Max.)[mV]

6.0

Input Bias Current(Typ.)[nA]

0.001

Slew Rate(Typ.)[V/µS]

1.0

Input Voltage Range [V]

VSS to VDD-1.2

Output Voltage Range [V]

VSS+0.1 to VDD-0.1

Voltage gain(Typ.)[dB]

95.0

Output current(Typ.)[mA]

8.0

CMRR(Typ.)[dB]

60.0

PSRR(Typ.)[dB]

80.0

GBW(Typ.)[MHz]

1.0

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

85

功能:

・可低電壓工作
    +1.7[V] ~ +5.5[V](單一電源)
・輸入接地感測、輸出全振幅作動
・可高速作動
・内建相位補償電容
・寬廣的工作温度範圍
    -40[℃] ~ +85[℃]
・直流電壓增益大
・低輸入偏壓電流 1[pA](Typ.)
・内建靜電保護電路
    人體模式(HBM)±4000[V](Typ.)

Design Resources

 

Documents

Application Note

  • Op amp Circuit Collection

Technical Articles

Schematic Design & Verification

  • Op-Amp / Comparator Tutorial
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Thermal Resistance

Tools

Simulations (Login Required)

  • Method for Exporting Circuit Data (ROHM Solution Simulator)

Models

  • BU7461G SPICE Model

2D/3D/CAD

  • SSOP5 Footprint / Symbol

Packaging & Quality

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)