Microwire BUS 2Kbit(128x16bit) EEPROM - BR93G56FVT-3


* 本產品是標準級的產品。本產品不建議使用的車載設備。
BR93G56FVT-3GE2 供貨中 TSSOP-B8 3000 3000 Taping Yes
Grade Standard
I/F MicroWire BUS(3-Wire)
Density [bit] 2K
Bit Format [Word x Bit] 128 x 16 / 256 x 8
Package TSSOP-B8
Operating Temperature (Min.)[°C] -40
Operating Temperature (Max.)[°C] 85
Vcc(Min.)[V] 1.7
Vcc(Max.)[V] 5.5
Circuit Current (Max.)[mA] 3.0
Standby Current (Max.)[μA] 2.0
Write Cycle (Max.)[ms] 5.0
Input Frequency (Max.)[Hz] 3M
Endurance (Max.)[Cycle] 106
Data Retention (Max.)[Year] 40
Comment Selectable the format(16bit or 8bit) by ORG-pin. Cu wire.
  • ・ 3-line communications of chip select, serial clock, serial data input / output (the case where input and output are shared)
    ・ Actions available at high speed 3MHz clock (4.5 V~5.5 V)
    ・ High speed write available (write time 5ms max.)
    ・ Same package and pin layout from 1Kbit to 16Kbit
    ・ 1.7~5.5V single power source action
    ・ Address auto increment function at read action
    ・ Write mistake prevention function » Write prohibition at power on » Write prohibition by command code » Write mistake prevention function at low voltage
    ・ Program cycle auto delete and auto end function
    ・ Program condition display by READY / BUSY
    ・ Dual organization : by 16 bit (X16) or 8 bit (X8)
    ・ Compact package SOP8/SOP-J8/SSOP-B8/TSSOP-B8/MSOP8/ TSSOP-B8J/DIP-T8/VSON008X2030
    ・ Data retention for 40 years
    ・ Data rewrite up to 1,000,000 times
    ・ Data at shipment all addresses FFFFh (X16) or FFh (X8)
其他新/當期相關產品 記憶體
料號 產品名稱 封裝 Datasheet 分銷庫存
BR93G56-3 Microwire BUS 2Kbit(128x16bit) EEPROM DIP-T8   購買
BR93G56F-3 Microwire BUS 2Kbit(128x16bit) EEPROM SOP8   購買
BR93G56FJ-3 Microwire BUS 2Kbit(128x16bit) EEPROM SOP-J8   購買
BR93G56FV-3 Microwire BUS 2Kbit(128x16bit) EEPROM SSOP-B8   購買
BR93G56FVJ-3 Microwire BUS 2Kbit(128x16bit) EEPROM TSSOP-B8J   購買
BR93G56FVM-3 Microwire BUS 2Kbit(128x16bit) EEPROM MSOP8   購買
New Products:
Thermal Resistance

The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.